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发布日期:2021年10月28日
系统级封装技术
系统级封装技术

Semiconductor companies are continuallyfaced with complex integration challenges as consumers want their electronicsto be smaller, faster and higher performance with more and more functionalitypacked into a single device. Semiconductor packaging has a significant impacton addressing these challenges. Current and future demands for greater systemperformance, increased functionality, reduced power consumption and reducedform factor require an advanced packaging approach known as system integration.

System integration is combining multipleintegrated circuits (ICs) and components into a single system or modularizedsub-system in order to achieve higher performance, functionality and processingspeeds with a significant reduction in space requirements inside theelectronics device.

Whatis System-in-Package?

System-in-Package (SiP) is a functionalelectronic system or sub-system that includes two or more heterogeneoussemiconductor die (often from different technology nodes optimized for theirindividual functionalities), usually with passive components. The physical formof SiP is a module, and depending on the end application, the module couldinclude a logic chip, memory, integrated passive devices (IPD), RF filters,sensors, heat sinks, antennas, connectors and/or power chip in packaged or baredie form.

Advantagesof Advanced SiP

To meet the need for increased integration,improved electrical performance, reduced power consumption, faster speed andsmaller device sizes, several advantages are driving the industry towardsadvanced SiP solutions including:

• Thinner / smaller form factor than individually packaged components
• Increased performance and functional integration
• Design flexibilities
• Better electromagnetic interference (EMI) isolation2019最新被窝电影网 手机在线,斗罗大陆第108全集 小草视频在线观看播放视频高清完整版免
• Reduced system board space and complexity
• Improved power management and more room for battery
• Simplified SMT assembly process
• Cost effective “plug-and-play” solutions
• Faster time-to-market (TTM)
• One stop turnkey solution – Wafer to fully tested SiP modules

Applications

Today, advanced SiP and miniaturizedmodules are being utilized in a number of markets such as mobile devices,Internet of Things (IoT), wearables, healthcare, industrial, automotive,computing and communication networks. Each advanced SiP solution varies incomplexity based on the number and functionality of the components required byeach application.

Following are examples of advanced SiPapplications:

• RF power amplifier (PA) modules
• Front-end modules (FEM)
• Power management integrated circuit (PMIC)
• Baseband / application processor (APU)
• High-end application processors (CPU, GPU)
• Connectivity modules
• Fingerprint sensors
• Micro-electromechanical systems (MEMS)
• Solid-state drives (SSD)

Depending on the application requirementsand product complexity, there are advanced SiP configurations ranging fromconventional 2D modules with multiple active and passive components,interconnected through flip chip, wire bonding and SMT to more complex modulessuch as Package-in-Package (PiP), Package-on-Package (PoP), 2.5D and 3Dintegrated solutions. The advanced SiP module configurations (2D/2.5D/3D) arecustomized for specific end applications to leverage a variety of potentialbenefits including performance, cost, form factor, and Time-to-Market (TTM).

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